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Fabrication of Al-Based Superconducting High-Aspect Ratio TSVS for Quantum 3D Integration2020 Proceedings, IEEE micro electro mechanical systems conference-paper Engineering 3D IC and TSV technologies Open access
J. A. Alfaro-Barrantes, Massimo Mastrangeli, David J. Thoen, Juan Bueno, J. J. A. Baselmans, Pasqualina Maria Sarro
6citations -
Characterization and video chain development of the CMOS detector applied in the multi-angle spectro-polarimeter SPEXone2021 International Conference on Space Optics (ICSO) conference-paper Engineering CCD and CMOS Imaging Sensors Open access
Jochen Campo, Paul J. J. Tol, Joris van der Vlugt, Martijn Smit, Jelle Talsma, Alexander B. C. Eigenraam, +5 more
4citations -
Comparative performance of MoS₂ transistors: Statistical study and one-transistor-one-resistive memory integration2025 Materials Science in Semiconductor Processing article Materials Science 2D Materials and Applications Open access
Fatemeh Khorramshahi, Heorhii Bohuslavskyi, Anton Murros, Agata Piacentini, M. Heuken, Max C. Lemme, +2 more
1citations -
OTTER - Two Transistor - One RRAM Architecture for Reliable In-Memory-Computing in 28 nm CMOS Technology2026 arXiv (Cornell University) preprint Engineering Advanced Memory and Neural Computing Open access
Yang Chen, Daniele Storelli, Xinyi Zhao, Ankit Bende, Paul-Philipp Manea, Oliver Artner, +17 more
0citations -
Qubit Bias using a CMOS DAC at mK Temperatures2022 IEEE International Conference on Electronics, Circuits and Systems (ICECS) conference-paper Engineering Analog and Mixed-Signal Circuit Design cited by 2 patents
René Otten, Lea Schreckenberg, Patrick Vliex, Julian Ritzmann, Arne Ludwig, Andreas Dirk Wieck, +1 more
11citations