Wafer-Scale Integration of 2D Materials for Application in High-Performance Electronics and Optoelectronics*

IEEE Nanotechnology Materials and Devices Conference (NMDC), pp. 75–76

Abstract

The fusion of 2D materials, particularly graphene, with silicon CMOS circuits holds immense potential to revolutionize electronics. This talk explores the seamless integration of these materials via Back-End-of-Line (BEOL) processing, highlighting their compatibility and performance benefits. Anticipated economic transformations in markets for graphene-based applications integrated with silicon underscore the significance of this advancement. Recent breakthroughs address pivotal challenges in wafer-scale processing, propelling us toward a future where 2D materials redefine technology’s horizons.

Authors 1

1. Zhenxing Wang corresponding Aachen AMO GmbH

   AMO (Germany)

   Affiliation as printed

   AMO GmbH, Otto-Blumenthal-Straße 25,Aachen,Germany,52074