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Modeling and experimental validation of a Wf/W-fabrication by chemical vapor deposition and infiltration2021 RWTH Publications (RWTH Aachen) conference-paper Engineering 3D IC and TSV technologies Open access
Leonard Raumann, J.W. Coenen, J. Riesch, Yu Mao, Daniel Schwalenberg, Tobias Wegener, +4 more
3citations
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