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Fabrication of gate electrodes for scalable quantum computing using CMOS industry compatible e-beam lithography and numerical simulation of the resulting quantum device2023 European Mask and Lithography Conference (EMLC) conference-paper Engineering Advancements in Photolithography Techniques
Varvara Brackmann, Malte Neul, W. Langheinrich, Maik Simon, Pascal Muster, Sebastian Pregl, +11 more
2citations -
Industrially Fabricated Single-Electron Quantum Dots in Si/Si—Ge Heterostructures2025 IEEE Electron Device Letters article Physics and Astronomy Quantum and electron transport phenomena Open access
Till Huckemann, Pascal Muster, W. Langheinrich, Varvara Brackmann, Nikola David Komericki, Laura K. Diebel, +7 more
13citations -
Review of Manufacturing Process Defects and Their Effects on Memristive Devices2021 Journal of Electronic Testing article Engineering Advanced Memory and Neural Computing Open access
L. M. Bolzani Poehls, Moritz Fieback, Susanne Hoffmann‐Eifert, T. Copetti, E. Brum, Stephan Menzel, +2 more
33citations -
Vertical Ge Gate-All-Around Nanowire pMOSFETs With a Diameter Down to 20 nm2020 IEEE Electron Device Letters article Engineering Advancements in Semiconductor Devices and Circuit Design
Mingshan Liu, Alexander Hardtdegen, Jin Hee Bae, Jean‐Michel Hartmann, Joachim Knoch, Detlev Grützmacher, +2 more
20citations -
Gate Camouflaging Using Reconfigurable ISFET-Based Threshold Voltage Defined Logic2023 IEEE Interregional NEWCAS Conference (NEWCAS) conference-paper Computer Science Physical Unclonable Functions (PUFs) and Hardware Security
Elmira Moussavi, Animesh Kumar Singh, Dominik Šišejković, Aravind Padma Kumar, Daniyar Kizatov, Sven Ingebrandt, +3 more
3citations -
Gate Camouflaging Using Reconfigurable ISFET-Based Threshold Voltage Defined Logic2023 RWTH Publications (RWTH Aachen) conference-paper Computer Science Physical Unclonable Functions (PUFs) and Hardware Security Open access
Elmira Moussavi, Animesh Kumar Singh, Dominik Šišejković, Aravind Padma Kumar, Daniyar Kizatov, Sven Ingebrandt, +3 more
0citations -
Dielectric Surface Charge Engineering for Electrostatic Doping of Graphene2020 ACS Applied Electronic Materials article Materials Science Graphene research and applications Open access cited by 4 patents
Sebastian Wittmann, Fabian Aumer, Doris Wittmann, Stephan Pindl, Stefan Wagner, Amit Gahoi, +4 more
21citations -
Highly-Conformal Sputtered Through-Silicon Vias With Sharp Superconducting Transition2021 Journal of Microelectromechanical Systems article Engineering 3D IC and TSV technologies Open access
J. A. Alfaro-Barrantes, Massimo Mastrangeli, David J. Thoen, Sven Visser, Juan Bueno, J. J. A. Baselmans, +1 more
13citations -
Fabrication of Al-Based Superconducting High-Aspect Ratio TSVS for Quantum 3D Integration2020 Proceedings, IEEE micro electro mechanical systems conference-paper Engineering 3D IC and TSV technologies Open access
J. A. Alfaro-Barrantes, Massimo Mastrangeli, David J. Thoen, Juan Bueno, J. J. A. Baselmans, Pasqualina Maria Sarro
6citations -
Plasmonic-assisted Mach-Zehnder Interferometric photonic sensor using aluminum waveguides2020 Conference on Lasers and Electro-Optics conference-paper Engineering Photonic and Optical Devices
E. Chatzianagnostou, Athanasios Manolis, George Dabos, Dimitra A. Ketzaki, Bartos Chmielak, Anna Lena Giesecke, +10 more
1citations