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Highly-Conformal Sputtered Through-Silicon Vias With Sharp Superconducting Transition

Journal of Microelectromechanical Systems, vol. 30, pp. 253–261

Abstract

This paper describes the microfabrication and electrical characterization of aluminum-coated superconducting through-silicon vias (TSVs) with sharp superconducting transition above 1 K. The sharp superconducting transition was achieved by means of fully conformal and void-free DC-sputtering of the TSVs with Al, and is here demonstrated in up to 500 μm-deep vias. Full conformality of Al sputtering was made possible by shaping the vias with a tailored hourglass profile, which allowed a metallic layer as thick as 430 nm to be deposited in the center of the vias. Single-via electric resistance as low as 160 mΩ at room temperature and superconductivity at 1.27 K were measured by a three-dimensional (3D) cross-bridge Kelvin resistor structure. This work establishes a CMOS-compatible fabrication process suitable for arrays of superconducting TSVs and 3D integration of superconducting silicon-based devices. [2020-0354].

Authors 7

  1. Instituto Tecnológico de Costa Rica · Delft University of Technology

    Affiliation as printed

    Electronic Components, Technology and Materials Group, Delft University of Technology, Delft, Netherlands

    Instituto Tecnológico de Costa Rica, Cartago, Costa Rica

  2. Delft University of Technology

    Affiliation as printed

    Electronic Components, Technology and Materials Group, Delft University of Technology, Delft, Netherlands

  3. Delft University of Technology

    Affiliation as printed

    Terahertz Sensing Group, Delft University of Technology, Delft, Netherlands

  4. Sven Visser Aachen

    Space Research Organisation Netherlands

    Affiliation as printed

    SRON, Utrecht, Netherlands

  5. Juan Bueno Aachen

    Space Research Organisation Netherlands · Delft University of Technology

    Affiliation as printed

    SRON, Utrecht, Netherlands

    Terahertz Sensing Group, Delft University of Technology, Delft, Netherlands

  6. Space Research Organisation Netherlands · Delft University of Technology

    Affiliation as printed

    SRON, Utrecht, Netherlands

    Terahertz Sensing Group, Delft University of Technology, Delft, Netherlands

  7. Delft University of Technology

    Affiliation as printed

    Electronic Components, Technology and Materials Group, Delft University of Technology, Delft, Netherlands

Cited by 13 stored of 13

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Cited by patents worldwide 2 (Lens.org)

References 33