Highly-Conformal Sputtered Through-Silicon Vias With Sharp Superconducting Transition
Journal of Microelectromechanical Systems, vol. 30, pp. 253–261
Abstract
This paper describes the microfabrication and electrical characterization of aluminum-coated superconducting through-silicon vias (TSVs) with sharp superconducting transition above 1 K. The sharp superconducting transition was achieved by means of fully conformal and void-free DC-sputtering of the TSVs with Al, and is here demonstrated in up to 500 μm-deep vias. Full conformality of Al sputtering was made possible by shaping the vias with a tailored hourglass profile, which allowed a metallic layer as thick as 430 nm to be deposited in the center of the vias. Single-via electric resistance as low as 160 mΩ at room temperature and superconductivity at 1.27 K were measured by a three-dimensional (3D) cross-bridge Kelvin resistor structure. This work establishes a CMOS-compatible fabrication process suitable for arrays of superconducting TSVs and 3D integration of superconducting silicon-based devices. [2020-0354].
Authors 7
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Instituto Tecnológico de Costa Rica · Delft University of Technology
Affiliation as printed
Electronic Components, Technology and Materials Group, Delft University of Technology, Delft, Netherlands
Instituto Tecnológico de Costa Rica, Cartago, Costa Rica
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Delft University of Technology
Affiliation as printed
Electronic Components, Technology and Materials Group, Delft University of Technology, Delft, Netherlands
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Delft University of Technology
Affiliation as printed
Terahertz Sensing Group, Delft University of Technology, Delft, Netherlands
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Sven Visser Aachen
Space Research Organisation Netherlands
Affiliation as printed
SRON, Utrecht, Netherlands
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Juan Bueno Aachen
Space Research Organisation Netherlands · Delft University of Technology
Affiliation as printed
SRON, Utrecht, Netherlands
Terahertz Sensing Group, Delft University of Technology, Delft, Netherlands
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J. J. A. Baselmans Aachen
Space Research Organisation Netherlands · Delft University of Technology
Affiliation as printed
SRON, Utrecht, Netherlands
Terahertz Sensing Group, Delft University of Technology, Delft, Netherlands
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Delft University of Technology
Affiliation as printed
Electronic Components, Technology and Materials Group, Delft University of Technology, Delft, Netherlands
Cited by 13 stored of 13
13 results
Cited by patents worldwide 2 (Lens.org)
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METHOD OF MANUFACTURING QUANTUM DEVICE AND QUANTUM DEVICEEP4694659A1 2026-02-11 Pending
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METHODS OF MANUFACTURING SUPERCONDUCTING VIA THROUGH SEMICONDUCTOR WAFERWO2024150003A1 2024-07-18 Pending