Graphene-Based Wireless Agile Interconnects for Massive Heterogeneous Multi-Chip Processors
IEEE Wireless Communications, vol. 30, pp. 162–169
Abstract
The main design principles in computer architecture have recently shifted from a monolithic scaling-driven approach to the development of heterogeneous architectures that tightly co-integrate multiple specialized processor and memory chiplets. In such data-hungry multi-chip architectures, current Networks-in-Package (NiPs) may not be enough to cater to their heterogeneous and fast-changing communication demands. This position article makes the case for wireless in-package networking as the enabler of efficient and versatile wired-wireless interconnect fabrics for massive heterogeneous processors. To that end, the use of graphene-based antennas and transceivers with unique frequency-beam reconfigurability in the terahertz band is proposed. The feasibility of such a wireless vision and the main research challenges toward its realization are analyzed from the technological, communications, and computer architecture perspectives.
Authors 21
-
Universitat Politècnica de Catalunya
Affiliation as printed
Universitat Politécnica de Catalunya,Spain
-
Universitat Politècnica de Catalunya
Affiliation as printed
Universitat Politécnica de Catalunya,Spain
-
Universitat Politècnica de Catalunya
Affiliation as printed
Universitat Politécnica de Catalunya,Spain
-
Universitat Politècnica de Catalunya
Affiliation as printed
Universitat Politécnica de Catalunya,Spain
-
Affiliation as printed
University of Siegen,Germany
University of Siegen, Germany
-
Affiliation as printed
University of Siegen,Germany
University of Siegen, Germany
-
Mohamed Saeed Aachen
Affiliation as printed
RWTH Aachen University,Germany
RWTH Aachen University, Germany
-
Renato Negra Aachen
Affiliation as printed
RWTH Aachen University,Germany
RWTH Aachen University, Germany
-
Affiliation as printed
AMO GmbH,Germany
AMO GmbH, Germany
-
AMO (Germany) · RWTH Aachen University
Affiliation as printed
RWTH Aachen University,Germany
AMO GmbH, Germany
RWTH Aachen University, Germany
-
AMO (Germany) · RWTH Aachen University
Affiliation as printed
RWTH Aachen University,Germany
AMO GmbH, Germany
RWTH Aachen University, Germany
-
Affiliation as printed
Swiss Federal Institute of Technology,Switzerland
Swiss Federal Institute of Technology, Switzerland
-
HES-SO University of Applied Sciences and Arts Western Switzerland · ETH Zurich
Affiliation as printed
Swiss Federal Institute of Technology,Switzerland
Swiss Federal Institute of Technology, Switzerland
University of Applied Sciences and Arts Western Switzerland, Switzerland
-
Affiliation as printed
Swiss Federal Institute of Technology,Switzerland
Swiss Federal Institute of Technology, Switzerland
-
Affiliation as printed
Swiss Federal Institute of Technology,Switzerland
Swiss Federal Institute of Technology, Switzerland
-
Affiliation as printed
University of Bologna,Italy
University of Bologna, Italy
-
Affiliation as printed
University of Bologna,Italy
University of Bologna, Italy
-
IBM (United States) · IBM Research - Zurich
Affiliation as printed
IBM Research Europe,Switzerland
IBM Research Europe, Switzerland
-
IBM (United States) · IBM Research - Zurich
Affiliation as printed
IBM Research Europe,Switzerland
IBM Research Europe, Switzerland
-
IBM (United States) · IBM Research - Zurich
Affiliation as printed
IBM Research Europe,Switzerland
IBM Research Europe, Switzerland
-
IBM (United States) · IBM Research - Zurich
Affiliation as printed
IBM Research Europe,Switzerland
IBM Research Europe, Switzerland
Cited by 27 stored of 27
No patents citing this paper on Lens.org (checked 2026-10-06).
References 16
-
W3101652597details pending0citations
-
W3006387027details pending0citations
16 results