3D Interconnect Architectures for Heterogeneous Technologies

Springer eBooks

Authors 4

1. Lennart Bamberg

   NXP (Germany)

   Affiliation as printed

   NXP Semiconductors, Hamburg, Germany

2. Jan Moritz Joseph Aachen

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University, Aachen, Germany

3. Alberto García-Ortiz

   University of Bremen

   Affiliation as printed

   Universität Bremen, Bremen, Germany

4. Thilo Pionteck

   Otto-von-Guericke-Universität Magdeburg

   Affiliation as printed

   Otto-von-Guericke Universität Magdeburg, Magdeburg, Germany