January 01, 2022 book-chapter Aachen paper

Low-Power Technique for Yield-Enhanced 3D Interconnects

Springer eBooks, pp. 227–263

DOI: 10.1007/978-3-030-98229-4_11 OpenAlex

Authors 4

Lennart Bamberg

NXP (Germany)

Affiliation as printed

NXP Semiconductors, Hamburg, Germany
Jan Moritz Joseph Aachen

RWTH Aachen University

Affiliation as printed

RWTH Aachen University, Aachen, Germany
Alberto García-Ortiz

University of Bremen

Affiliation as printed

Universität Bremen, Bremen, Germany
Thilo Pionteck

Otto-von-Guericke-Universität Magdeburg

Affiliation as printed

Otto-von-Guericke Universität Magdeburg, Magdeburg, Germany

Cited by 1 stored of 1

3D Interconnect Architectures for Heterogeneous Technologies
2022 Springer eBooks book Engineering 3D IC and TSV technologies

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citations

1 result

No patents citing this paper on Lens.org (checked 2026-10-06).

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