June 26, 2026 article Double-Sided Funnel-Shaped Through Silicon Via Interposer by Wet-Etching Method for Superconducting Quantum Application IEEE Electron Device Letters DOI: 10.1109/led.2026.3703907 OpenAlex Authors 0 Author list not loaded yet. Cited by 0 stored of 0 References 2 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Superconducting High-Aspect Ratio Through-Silicon Vias with DC-Sputtered Al for Quantum 3D integration 2020 IEEE Electron Device Letters article Engineering 3D IC and TSV technologies Open access cited by 2 patents 23 citations Highly-Conformal Sputtered Through-Silicon Vias With Sharp Superconducting Transition 2021 Journal of Microelectromechanical Systems article Engineering 3D IC and TSV technologies Open access cited by 2 patents 13 citations 2 results