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Diagnosing Thermal-Interface Aging of Power Devices Using Self-Sensing2024 IEEE Transactions on Power Electronics article Engineering Electronic Packaging and Soldering Technologies
Isabel Austrup, Christoph H. van der Broeck, Sven Kalker, Tianlong B. Albert, Fabian Janoth, Rik W. De Doncker
4citations -
TEM and Synchrotron X-ray Study of the Evolution of Phases Formed During Bonding of IN718/Al/IN718 Couples by TLPB2021 Metallurgical and Materials Transactions A article Engineering Electronic Packaging and Soldering Technologies Open access
Mariana Poliserpi, Pere Barriobero Vila, Guillermo Carlos Requena, Laura Noel García, Alfredo J. Tolley, María Cecilia Poletti, +6 more
3citations -
Direct Electroplating on Indium-Tin-Oxide-Coated Textured and Polished Silicon Substrates via Transition Metal Alloyed Interlayers2022 Journal of The Electrochemical Society article Engineering Electronic Packaging and Soldering Technologies Open access
Jochen Politze, Stefan Michael Scholz, H. Windgassen, Weiyuan Duan, Joachim Knoch
2citations -
Influence of transient temperature on liquid metal embrittlement (LME) of Laser-DED brazed CuSn12Ni2 on 42CrMo4 investigated via 2D-quotient thermography2026 RWTH Publications (RWTH Aachen) article Engineering Electronic Packaging and Soldering Technologies Open access
Marcel Troise, Karthik Ravi Krishna Murthy, Simon Olschok, Uwe Reisgen
0citations
17 results
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Joachim Mayer 17,969 citations overall2 papers
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