Papers matching “through-silicon vias” in 3D IC and TSV technologies 8
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Highly-Conformal Sputtered Through-Silicon Vias With Sharp Superconducting Transition2021 Journal of Microelectromechanical Systems article Engineering 3D IC and TSV technologies Open access cited by 2 patents
J. A. Alfaro-Barrantes, Massimo Mastrangeli, David J. Thoen, Sven Visser, Juan Bueno, J. J. A. Baselmans, +1 more
13citations -
Superconducting High-Aspect Ratio Through-Silicon Vias with DC-Sputtered Al for Quantum 3D integration2020 IEEE Electron Device Letters article Engineering 3D IC and TSV technologies Open access cited by 2 patents
J. A. Alfaro-Barrantes, Massimo Mastrangeli, David J. Thoen, Sven Visser, Juan Bueno, J. J. A. Baselmans, +1 more
23citations -
Fabrication of Al-Based Superconducting High-Aspect Ratio TSVS for Quantum 3D Integration2020 Proceedings, IEEE micro electro mechanical systems conference-paper Engineering 3D IC and TSV technologies Open access cited by 3 patents
J. A. Alfaro-Barrantes, Massimo Mastrangeli, David J. Thoen, Juan Bueno, J. J. A. Baselmans, Pasqualina Maria Sarro
6citations -
Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators2021 International Symposium on Quality Electronic Design (ISQED) conference-paper Engineering 3D IC and TSV technologies Open access
Jan Moritz Joseph, Ananda Samajdar, Lingjun Zhu, Rainer Leupers, Sung Kyu Lim, Thilo Pionteck, +1 more
12citations
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