Papers in Electronic Packaging and Soldering Technologies 10
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STEM investigations of the influence of copper on alumina scale detachment during in-situ wetting experiments of Al-7Si-0.3Mg alloy with 95Sn-5Cu filler metal2021 International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde) article Engineering Electronic Packaging and Soldering Technologies
Ashok Vayyala, Anke Aretz, Kirsten Bobzin, W. Wietheger, Julian Hebing, Riza Iskandar, +2 more
1citations -
New Opportunities for Brazing Research by in situ Experiments in a Large Chamber Scanning Electron Microscope2021 Lecture notes in mechanical engineering conference-paper Engineering Electronic Packaging and Soldering Technologies
Anke Aretz, Riza Iskandar, Joachim Mayer, Kirsten Bobzin, Alexander SCHMIDT, Thomas E. Weirich
0citations
10 results