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Protemics (Germany)
28 stored papers ·
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Open access
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
2021
Nature Communications
article
Materials Science
Graphene research and applications
Open access
cited by 2 patents
213
citations
On-Chip Time-Domain Terahertz Spectroscopy of Superconducting Films below the Diffraction Limit
2023
Nano Letters
article
Physics and Astronomy
Superconducting and THz Device Technology
Open access
32
citations
Assessment of Wafer‐Level Transfer Techniques of Graphene with Respect to Semiconductor Industry Requirements
2023
Advanced Materials Technologies
article
Materials Science
Graphene research and applications
Open access
19
citations
Reliable Lift‐Off Patterning of Graphene Dispersions for Humidity Sensors
2024
Advanced Materials Interfaces
article
Engineering
Nanomaterials and Printing Technologies
Open access
7
citations
On-Chip Terahertz Sensor Based on Low-Loss Coplanar Strip Lines for the Analysis of Microscale Two-dimensional Materials
2022
2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz)
conference-paper
Engineering
Terahertz technology and applications
5
citations
A 1550-nm-wavelength compatible photoconductive microprobe transceiver for Terahertz near-field reflection measurements
2020
conference-paper
Engineering
Terahertz technology and applications
5
citations
High-resolution Terahertz near-field reflection measurements for complementary non-destructive inspection of integrated circuits
2021
International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
conference-paper
Engineering
Terahertz technology and applications
4
citations
Graphene-based thin-films for flexible applications inspected by high-resolution Terahertz near-field inspection
2021
conference-paper
Physics and Astronomy
Semiconductor materials and interfaces
3
citations
A novel scattering-type SNOM-tip featuring a micro-integrated bias-free optically driven terahertz pulse emitter
2020
conference-paper
Engineering
Near-Field Optical Microscopy
cited by 2 patents
3
citations
Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding
2021
Conference on Lasers and Electro-Optics
conference-paper
Materials Science
2D Materials and Applications
Open access
2
citations
Sparse-deconvolution terahertz near-field microprobe tomography enabling non-destructive inspection of small solid dosage forms
2024
International Journal of Pharmaceutics
article
Engineering
Near-Field Optical Microscopy
Open access
2
citations
Near-Field Semiconductor Imaging and Classification Enabled by Signal Cancellation Using Truncated mm-Wave Silicon Waveguide
2025
IEEE Sensors Journal
article
Engineering
Integrated Circuits and Semiconductor Failure Analysis
Open access
2
citations
Interconnection challenges on integrated terahertz photonic systems
2021
conference-paper
Engineering
Photonic and Optical Devices
2
citations
Photonic THz near-field imaging: Characterizing high-frequency components from 100 GHz to 4 THz
2022
2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz)
conference-paper
Engineering
Terahertz technology and applications
2
citations
A Terahertz s-SNOM tip with integrated photoconductive emitter switch evaluated on an AFM-system platform
2021
International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
conference-paper
Engineering
Terahertz technology and applications
1
citations
LT-GaAs-based THz transceiver probe with active single-antenna for sub-50 μm spatial-resolution reflection measurements
2022
International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
conference-paper
Engineering
Terahertz technology and applications
1
citations
A novel scattering-type THz microprobe with integrated source and detector for contact-free, high-speed surface imaging at sub-μm-resolution
2023
conference-paper
Engineering
Terahertz technology and applications
1
citations
Photoconductive THz near-field detectors operated with a 1550 nm cw-laser system for high spatial- and spectral-resolution measurements
2023
International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
conference-paper
Engineering
Terahertz technology and applications
1
citations
On-Chip THz Time-Domain Spectroscopy Sensor with Adjustable Sample Interaction by a Daughterboard
2023
International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
conference-paper
Engineering
Terahertz technology and applications
1
citations
Wafer-scale integration of layered 2D materials by adhesive wafer bonding
2022
conference-paper
Materials Science
Graphene research and applications
1
citations
1–20 of 28
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M. Nagel
Protemics (Germany)
Engineering
3.7k
citations
26
h-index
23
Aachen papers
Simon Sawallich
Protemics (Germany)
·
RWTH Aachen University
Engineering
461
citations
10
h-index
23
Aachen papers
Joon-Woo Lee
Yonsei University
·
Protemics (Germany)
Engineering
454
citations
8
h-index
1
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Jimin Lee
Georgia Institute of Technology
·
Seoul National University
Engineering
444
citations
12
h-index
4
Aachen papers
Alexander Michalski
Engineering
409
citations
11
h-index
14
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Jimin Lee
Chung-Ang University
Engineering
171
citations
4
h-index
1
Aachen papers
Michael Nage
Protemics (Germany)
Engineering
1
citations
1
h-index
1
Aachen papers
S. Sawallich
Protemics (Germany)
Materials Science
0
citations
0
h-index
1
Aachen papers
A. Michalski
Protemics (Germany)
Chemistry
0
citations
0
h-index
1
Aachen papers
Alexander Michalski
Protemics (Germany)
Materials Science
0
citations
0
h-index
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Aachen papers