Near-Field Semiconductor Imaging and Classification Enabled by Signal Cancellation Using Truncated mm-Wave Silicon Waveguide

IEEE Sensors Journal, vol. 25, pp. 20648–20657

Abstract

We demonstrate that a straightforward truncated silicon dielectric waveguide serves as an effective millimeter-wave (mm-wave) near-field semiconductor imaging sensor. The strong localization of modal fields at the truncated silicon tip interface results in fine resolution below the diffraction limit. It is found that, at a specific probing distance, high conductance of a metallized sample exhibits lower reflection than bare silicon substrate due to the signal cancellation with the reflection generated from the significant mismatch at the truncated interface. We experimentally validate that this cancellation effect is dependent upon conductivity and it allows us to differentiate multiple levels of conductivity. With this technique, we achieve the resolution of ~1/3 λ0 and a high image contrast of ~20 dB between conductors and the bare silicon substrate. In addition, a cancellation effect is employed that allows for accurate calibration of working distance, providing stable responses across the scanning area. We demonstrate how this effect can be exploited for high-accuracy material classification with broadband spectral correlation analysis enabled by the silicon sensor. The proposed method can be easily incorporated with integrated all-silicon circuits, showing promise for cost-effective, compact imaging modules, which is highly beneficial for real-world deployment in the industry.

Authors 7

1. Yuma Kawamoto

   Universidad Carlos III de Madrid

   Affiliation as printed

   Aerospace Engineering Department, Universidad Carlos III de Madrid, Madrid, Spain

   Universidad Carlos III de Madrid, Madrid, Spain

2. Daniel C. Gallego
   Affiliation as printed

   LeapWave Technologies, Leganés, Spain

3. Alejandro Rivera-Lavado
   Affiliation as printed

   LeapWave Technologies, Leganés, Spain

4. Tadao Nagatsuma

   The University of Osaka

   Affiliation as printed

   Institute of Scientific and Industrial Research, Osaka University, Osaka, Japan

   The Institute of Scientific and Industrial Research, Osaka University, Osaka, Japan

5. Michael Nagel Aachen Protemics GmbH

   Protemics (Germany)

   Affiliation as printed

   Protemics GmbH, Aachen, Germany

6. Daniel Jonathan Headland

   Universidad Carlos III de Madrid

   Affiliation as printed

   Optoelectronics and Laser Technology Group, Universidad Carlos III de Madrid, Madrid, Spain

7. Guillermo Carpintero

   Universidad Carlos III de Madrid

   Affiliation as printed

   Optoelectronics and Laser Technology Group, Universidad Carlos III de Madrid, Madrid, Spain

   LeapWave Technologies, Leganés, Spain