Papers matching “3D integrated circuits” in 3D IC and TSV technologies 2
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Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators2021 International Symposium on Quality Electronic Design (ISQED) conference-paper Engineering 3D IC and TSV technologies Open access
Jan Moritz Joseph, Ananda Samajdar, Lingjun Zhu, Rainer Leupers, Sung Kyu Lim, Thilo Pionteck, +1 more
12citations
2 results