Button shear testing for adhesion measurements of 2D materials

Nature Communications, vol. 15, pp. 2430

Abstract

Two-dimensional (2D) materials are considered for numerous applications in microelectronics, although several challenges remain when integrating them into functional devices. Weak adhesion is one of them, caused by their chemical inertness. Quantifying the adhesion of 2D materials on three-dimensional surfaces is, therefore, an essential step toward reliable 2D device integration. To this end, button shear testing is proposed and demonstrated as a method for evaluating the adhesion of 2D materials with the examples of graphene, hexagonal boron nitride (hBN), molybdenum disulfide, and tungsten diselenide on silicon dioxide and silicon nitride substrates. We propose a fabrication process flow for polymer buttons on the 2D materials and establish suitable button dimensions and testing shear speeds. We show with our quantitative data that low substrate roughness and oxygen plasma treatments on the substrates before 2D material transfer result in higher shear strengths. Thermal annealing increases the adhesion of hBN on silicon dioxide and correlates with the thermal interface resistance between these materials. This establishes button shear testing as a reliable and repeatable method for quantifying the adhesion of 2D materials.

Authors 16

1. Josef Schätz Aachen Chair of Electronic Devices

   RWTH Aachen University

   Affiliation as printed

   Chair of Electronic Devices, RWTH Aachen University, Otto-Blumenthal-Str. 25, 52074, Aachen, Germany

   Infineon Technologies AG, Wernerwerkstraße 2, 93049, Regensburg, Germany

2. Navin Nayi
   Affiliation as printed

   Infineon Technologies AG, Wernerwerkstraße 2, 93049, Regensburg, Germany

3. Jonas Weber

   Universitat de Barcelona · Deggendorf Institute of Technology

   Affiliation as printed

   Department of Applied Physics, University of Barcelona, Martí i Franquès 1, 08028, Barcelona, Spain

   Department of Electrical Engineering and Media Technology, Deggendorf Institute of Technology, Dieter-Görlitz-Platz 1, 94469, Deggendorf, Germany

4. Christoph Metzke

   Helmut Schmidt University · Deggendorf Institute of Technology

   Affiliation as printed

   Department of Electrical Engineering and Media Technology, Deggendorf Institute of Technology, Dieter-Görlitz-Platz 1, 94469, Deggendorf, Germany

   Department of Electrical Engineering, Helmut Schmidt University/University of the Federal Armed Forces Hamburg, Holstenhofweg 85, 22043, Hamburg, Germany

5. Sebastian Lukas Aachen Chair of Electronic Devices

   RWTH Aachen University

   Affiliation as printed

   Chair of Electronic Devices, RWTH Aachen University, Otto-Blumenthal-Str. 25, 52074, Aachen, Germany

6. Jürgen Walter
   Affiliation as printed

   Infineon Technologies AG, Wernerwerkstraße 2, 93049, Regensburg, Germany

7. T. Schaffus
   Affiliation as printed

   Infineon Technologies AG, Wernerwerkstraße 2, 93049, Regensburg, Germany

8. Fabian Streb
   Affiliation as printed

   Infineon Technologies AG, Wernerwerkstraße 2, 93049, Regensburg, Germany

9. Eros Reato Aachen Chair of Electronic Devices

   RWTH Aachen University

   Affiliation as printed

   Chair of Electronic Devices, RWTH Aachen University, Otto-Blumenthal-Str. 25, 52074, Aachen, Germany

10. Agata Piacentini Aachen AMO GmbH Advanced Microelectronic Center Aachen Chair of Electronic Devices

    AMO (Germany) · RWTH Aachen University

    Affiliation as printed

    AMO GmbH, Advanced Microelectronic Center Aachen, Otto-Blumenthal-Str. 25, 52074, Aachen, Germany

    Chair of Electronic Devices, RWTH Aachen University, Otto-Blumenthal-Str. 25, 52074, Aachen, Germany

11. Annika Grundmann Aachen Compound Semiconductor Technology

    RWTH Aachen University

    Affiliation as printed

    Compound Semiconductor Technology, RWTH Aachen University, Sommerfeldstr. 18, 52074, Aachen, Germany

12. H. Kalisch Aachen Compound Semiconductor Technology

    RWTH Aachen University

    Affiliation as printed

    Compound Semiconductor Technology, RWTH Aachen University, Sommerfeldstr. 18, 52074, Aachen, Germany

13. M. Heuken Aachen Compound Semiconductor Technology

    Aixtron (Germany) · RWTH Aachen University

    Affiliation as printed

    AIXTRON SE, Dornkaulstr. 2, 52134, Herzogenrath, Germany

    Compound Semiconductor Technology, RWTH Aachen University, Sommerfeldstr. 18, 52074, Aachen, Germany

14. Andrei Vescan Aachen Compound Semiconductor Technology

    RWTH Aachen University

    Affiliation as printed

    Compound Semiconductor Technology, RWTH Aachen University, Sommerfeldstr. 18, 52074, Aachen, Germany

15. Stephan Pindl
    Affiliation as printed

    Infineon Technologies AG, Wernerwerkstraße 2, 93049, Regensburg, Germany

16. Max C. Lemme corresponding Aachen AMO GmbH Advanced Microelectronic Center Aachen Chair of Electronic Devices

    AMO (Germany) · RWTH Aachen University

    Affiliation as printed

    AMO GmbH, Advanced Microelectronic Center Aachen, Otto-Blumenthal-Str. 25, 52074, Aachen, Germany. max.lemme@rwth-aachen.de

    Chair of Electronic Devices, RWTH Aachen University, Otto-Blumenthal-Str. 25, 52074, Aachen, Germany. max.lemme@rwth-aachen.de

    AMO GmbH, Advanced Microelectronic Center Aachen, Otto-Blumenthal-Str. 25, 52074, Aachen, Germany