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Copper Interconnects and Reliability Sign in to save
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Papers 11
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Structural and electrical properties of fiber textured and epitaxial molybdenum thin films prepared by magnetron sputter epitaxy2025 Applied Physics Letters article Materials Science Copper Interconnects and Reliability Open access
Balasubramanian Sundarapandian, Mohit Raghuwanshi, Patrik Straňák, Yuan Yu, Haiyan Lyu, Mario Prescher, +2 more
7citations -
Comparison of the Coating Structure of Silicon‐Based PECVD Coatings With Varying Organic Content2025 Plasma Processes and Polymers article Materials Science Copper Interconnects and Reliability Open access
Jonas Franke, Maciej Oskar Liedke, Maik Butterling, Ahmed G. Attallah, Andreas Wagner, Rainer Dahlmann
3citations -
Comparison of the coating structure of silicon-based pecvd coatings with varying organic content2025 Plasma Processes and Polymers article Materials Science Copper Interconnects and Reliability Open access
Jonas Cyrus Franke, Maciej Oskar Liedke, Andreas Schäfer, Maik Butterling, Ahmed G. Attallah, Rainer Dahlmann
0citations -
Designing Defect Structure and Interfacial Strain in an Epitaxial VN Bilayer Film by Tailoring N Concentration2026 Advanced Materials Interfaces article Materials Science Copper Interconnects and Reliability Open access
Marcus Hans, Damian Mauritius Holzapfel, Zhuo Chen, Soheil Karimi Aghda, Michal Fečík, Daniel Primetzhofer, +2 more
0citations
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Most active Aachen authors
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Rainer Dahlmann 717 citations overall5 papers
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