June 01, 2026 conference-paper Design-Oriented Modeling of TSV Substrate Noise Coupling to Ring VCOs International Conference on Modern Circuits and Systems Technologies DOI: 10.1109/mocast70204.2026.11626350 OpenAlex Authors 0 Author list not loaded yet. Cited by 0 stored of 0 References 1 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access 3D Interconnect Architectures for Heterogeneous Technologies 2022 Springer eBooks book Engineering 3D IC and TSV technologies 6 citations 1 result