September 15, 2025 conference-paper Chip-Scale 3D Quilt Packaging for Modular Neural Implants DOI: 10.23919/empc63132.2025.11222409 OpenAlex Authors 0 Author list not loaded yet. Cited by 0 stored of 0 References 1 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access High‐density implantable neural electrodes and chips for massive neural recordings 2024 Brain‐X article Neuroscience Neuroscience and Neural Engineering Open access 32 citations 1 result