High‐density implantable neural electrodes and chips for massive neural recordings
Brain‐X, vol. 2
Abstract
Abstract High‐density neural recordings with superior spatiotemporal resolution powerfully unveil cellular‐scale neural communication, showing great promise in neural science, translational medicine, and clinical applications. To achieve such, many design and fabrication innovations enhanced the electrode, chip, or both for biocompatibility improvement, electrical performance upgrade, and size miniaturization, offering several thousands of recording sites. However, an enormous gap exists along the trajectory toward billions of recording sites for brain scale resolution, posing many more design challenges. This review tries to find possible insight into mitigating the gap by discussing the latest progress in high‐density electrodes and chips for neural recordings. It emphasizes the design, fabrication, bonding techniques, and in vivo performance optimization of high‐density electrodes. It discusses the promising opportunities for circuit‐level and architecture‐level multi‐channel chip design innovations. We expect that joint effort and close collaboration between high‐density electrodes and chips will pave the way to high‐resolution neural recording tools supporting cutting‐edge neuroscience discoveries and applications.
Authors 11
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Affiliation as printed
DCI Joint Team Collaborative Innovation Center of IFSA Shanghai Jiao Tong University Shanghai China
Department of Micro/Nano Electronics Shanghai Jiao Tong University Shanghai China
National Key Laboratory of Advanced Micro and Nano Manufacture Technology Shanghai Jiao Tong University Shanghai China
DCI Joint Team, Collaborative Innovation Center of IFSA, Shanghai Jiao Tong University, Shanghai, China
Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China
National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, China
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Affiliation as printed
Department of Micro/Nano Electronics Shanghai Jiao Tong University Shanghai China
Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China
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Northwestern Polytechnical University
Affiliation as printed
Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace School of Mechanical Engineering Northwestern Polytechnical University Xi'an Shaanxi China
National Key Laboratory of Unmanned Aerial Vehicle Technology Xi'an Shaanxi China
Unmanned System Research Institute Northwestern Polytechnical University Xi'an Shaanxi China
Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace, School of Mechanical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, China
National Key Laboratory of Unmanned Aerial Vehicle Technology, Xi'an, Shaanxi, China
Unmanned System Research Institute, Northwestern Polytechnical University, Xi'an, Shaanxi, China
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Northwestern Polytechnical University
Affiliation as printed
Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace School of Mechanical Engineering Northwestern Polytechnical University Xi'an Shaanxi China
National Key Laboratory of Unmanned Aerial Vehicle Technology Xi'an Shaanxi China
Unmanned System Research Institute Northwestern Polytechnical University Xi'an Shaanxi China
National Key Laboratory of Unmanned Aerial Vehicle Technology, Xi'an, Shaanxi, China
Unmanned System Research Institute, Northwestern Polytechnical University, Xi'an, Shaanxi, China
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Affiliation as printed
DCI Joint Team Collaborative Innovation Center of IFSA Shanghai Jiao Tong University Shanghai China
Department of Micro/Nano Electronics Shanghai Jiao Tong University Shanghai China
National Key Laboratory of Advanced Micro and Nano Manufacture Technology Shanghai Jiao Tong University Shanghai China
Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China
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Affiliation as printed
Institute of Guizhou Aerospace Measuring and Testing Technology Guiyang Guizhou China
Institute of Guizhou Aerospace Measuring and Testing Technology, Guiyang, Guizhou, China
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Affiliation as printed
Leiden Institute of Advanced Computer Science (LIACS) Leiden University Leiden The Netherlands
Leiden Institute of Advanced Computer Science (LIACS), Leiden University, Leiden, The Netherlands
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Affiliation as printed
Klipsch School of Electrical and Computer Engineering New Mexico State University Las Cruces New Mexico USA
Klipsch School of Electrical and Computer Engineering, New Mexico State University, Las Cruces, New Mexico, USA
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Yang Zhao corresponding
Affiliation as printed
Department of Micro/Nano Electronics Shanghai Jiao Tong University Shanghai China
Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China
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Bowen Ji corresponding
Northwestern Polytechnical University
Affiliation as printed
Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace School of Mechanical Engineering Northwestern Polytechnical University Xi'an Shaanxi China
National Key Laboratory of Unmanned Aerial Vehicle Technology Xi'an Shaanxi China
Unmanned System Research Institute Northwestern Polytechnical University Xi'an Shaanxi China
Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace, School of Mechanical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, China
National Key Laboratory of Unmanned Aerial Vehicle Technology, Xi'an, Shaanxi, China
Unmanned System Research Institute, Northwestern Polytechnical University, Xi'an, Shaanxi, China
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Jingquan Liu corresponding
Affiliation as printed
DCI Joint Team Collaborative Innovation Center of IFSA Shanghai Jiao Tong University Shanghai China
Department of Micro/Nano Electronics Shanghai Jiao Tong University Shanghai China
National Key Laboratory of Advanced Micro and Nano Manufacture Technology Shanghai Jiao Tong University Shanghai China
DCI Joint Team, Collaborative Innovation Center of IFSA, Shanghai Jiao Tong University, Shanghai, China
Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China
National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, China
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