April 01, 2023 conference-paper Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads Design, Automation, and Test in Europe DOI: 10.23919/date56975.2023.10137047 OpenAlex Authors 0 Author list not loaded yet. Cited by 0 stored of 9 References 1 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators 2021 conference-paper Engineering Advanced Memory and Neural Computing Open access 12 citations 1 result