Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging

European Conference on Optical Communication

Abstract

We report on glass-molded micro-optical interposers for single mode fiber-to-PIC coupling fabricated at the wafer scale that result in less than 1 dB excess insertion losses. They allow a narrow package footprint and can be extended to support polarization management, isolation and wavelength multiplexing.

Authors 5

1. Florian Merget Aachen Chair of Integrated Photonics

   RWTH Aachen University

   Affiliation as printed

   Chair of Integrated Photonics, RWTH Aachen, Aachen

   aiXscale Photonics UG, Köln, Germany

2. Manuel Ackermann Aachen Chair of Integrated Photonics

   RWTH Aachen University

   Affiliation as printed

   Chair of Integrated Photonics, RWTH Aachen, Aachen

3. Sebastian Haag
   Affiliation as printed

   Aixemtec GmbH, Herzogenrath, Germany

4. Martin Wölz
   Affiliation as printed

   GD Optical Competence GmbH, Sinn, Germany

5. Jeremy Witzens Aachen Chair of Integrated Photonics

   RWTH Aachen University

   Affiliation as printed

   Chair of Integrated Photonics, RWTH Aachen, Aachen

   aiXscale Photonics UG, Köln, Germany