January 01, 2020 conference-paper 1.6Tbps Silicon Photonics Integrated Circuit for Co-Packaged Optical-IO Switch Applications Optical Fiber Communication Conference DOI: 10.1364/ofc.2020.t3h.1 OpenAlex Authors 0 Author list not loaded yet. Cited by 2 stored of 60 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Glass-molded optical interposers for wafer scale photonic integrated circuit packaging in 800G modules and co-packaged optics 2022 conference-paper Engineering Photonic and Optical Devices Open access 5 citations Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging 2021 European Conference on Optical Communication conference-paper Engineering Photonic and Optical Devices cited by 1 patent 1 citations 2 results References 0