Scalable PIC packaging and polarization control in CPO

Abstract

The emergence of co-packaged optics and of parallel optics pluggable form factors with an increased number of fibers poses new challenges for optical packaging technologies. We describe micro-optical interposers manufactured with isothermal glass molding that enable the parallelized connection of large fiber arrays with photonic integrated circuits in a low-rise form factor as well as the management of scrambled light polarization from a remote laser source coupled by single mode fiber. A resonantly assisted but temperature tolerant silicon photonics Mach-Zehnder modulator operated in lumped element configuration is co-developed for that purpose and a concept for a 6.4 Tb/s bi-directional light engine described.

Authors 6

1. Florian Merget
   Affiliation as printed

   Institute of Integrated Photonics (Germany)

   aiXscale Photonics GmbH (Germany)

2. Manuel Ackermann Aachen Institute of Integrated Photonics (IPH)

   RWTH Aachen University

   Affiliation as printed

   Institute of Integrated Photonics, Campus Boulevard 73, 52074 Aachen, Germany;

   aiXscale Photonics GmbH, Campus Boulevard 79, 52074 Aachen, Germany;

3. Bin Shen
   Affiliation as printed

   aiXscale Photoncs GmbH (Germany)

4. Rebecca Rodrigo
   Affiliation as printed

   Institute of Integrated Photonics (Germany)

5. Huiyi Wang
   Affiliation as printed

   Institute of Integrated Photonics (Germany)

6. Jeremy Witzens
   Affiliation as printed

   Institute of Integrated Photonics (Germany)

   aiXscale Photonics GmbH (Germany)