November 01, 2010 conference-paper Open access 3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling DOI: 10.1109/iccad.2010.5653749 Full text (OA) OpenAlex Authors 0 Author list not loaded yet. Cited by 2 stored of 285 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Thermal-EXAMINER: IP Extraction from MAGIC Logic-in-Memory Using Thermal Side-Channel Attacks 2025 IEEE Nordic Circuits and Systems Conference (NorCAS) conference-paper Computer Science Physical Unclonable Functions (PUFs) and Hardware Security 0 citations Analysis of Thermal Side-Channel Attacks on Analog/Digital Computing-in-Memory Accelerators 2024 IEEE Latin American Test Symposium (LATS) conference-paper Engineering Advanced Memory and Neural Computing 1 citations 2 results References 0