October 01, 2006 article Using Transmission Laser Bonding Technique for Line Bonding in Microsystem Packaging IEEE Transactions on Electronics Packaging Manufacturing DOI: 10.1109/tepm.2006.887356 OpenAlex Authors 0 Author list not loaded yet. Cited by 1 stored of 7 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Laser Transmission Bonding 2023 RWTHedition book-chapter Engineering Electronic Packaging and Soldering Technologies 0 citations 1 result References 0