May 28, 2013 conference-paper Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs Proceedings - ACM IEEE Design Automation Conference DOI: 10.1145/2463209.2488956 OpenAlex Authors 0 Author list not loaded yet. Cited by 3 stored of 38 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Technology-aware Router Architectures for On-Chip-Networks in Heterogeneous Technologies 2021 conference-paper Computer Science Interconnection Networks and Systems 0 citations Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators 2021 International Symposium on Quality Electronic Design (ISQED) conference-paper Engineering 3D IC and TSV technologies Open access 12 citations Bridging the Frequency Gap in Heterogeneous 3D SoCs through Technology-Specific NoC Router Architectures 2021 Asia and South Pacific Design Automation Conference (ASP-DAC) conference-paper Computer Science Interconnection Networks and Systems 2 citations 3 results References 0