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STEM investigations of the influence of copper on alumina scale detachment during in-situ wetting experiments of Al-7Si-0.3Mg alloy with 95Sn-5Cu filler metal2021 International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde) article Engineering Electronic Packaging and Soldering Technologies
Ashok Vayyala, Anke Aretz, Kirsten Bobzin, W. Wietheger, Julian Hebing, Riza Iskandar, +2 more
1citations -
Nb‐Mediated Grain Growth and Grain‐Boundary Engineering in Mg 3 Sb 2 ‐Based Thermoelectric Materials2021 Advanced Functional Materials article Materials Science Advanced Thermoelectric Materials and Devices Open access
Ting Luo, Jimmy Jiahong Kuo, Kent J. Griffith, Kazuki Imasato, Oana Cojocaru‐Mirédin, Matthias Wuttig, +3 more
121citations
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