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Topic: Electronic Packaging and Soldering Technologies ×

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Papers matching “brazing” in Electronic Packaging and Soldering Technologies 3

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Brazing of Sn78Cu22 on aluminum substrates observed via in-situ experiments in a large-chamber SEM
2026 Discover Mechanical Engineering article Engineering Electronic Packaging and Soldering Technologies Open access

Shohreh Khatami, Joachim Mayer, Anke Aretz, Bei Zhou, Markus Apel

0

citations
Brazing of Sn78Cu22 on aluminum substrates observed via in-situ experiments in a large-chamber SEM
2026 Discover Mechanical Engineering article Engineering Electronic Packaging and Soldering Technologies Open access

Shohreh Khatami, Joachim Mayer, Anke Aretz, Bei Zhou, Markus Apel

0

citations
Influence of transient temperature on liquid metal embrittlement (LME) of Laser-DED brazed CuSn12Ni2 on 42CrMo4 investigated via 2D-quotient thermography
2026 RWTH Publications (RWTH Aachen) article Engineering Electronic Packaging and Soldering Technologies Open access

Marcel Troise, Karthik Ravi Krishna Murthy, Simon Olschok, Uwe Reisgen

0

citations

3 results