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Integrated Wheel Sensor Communication Using ESP32 - A Contribution Towards a Digital Twin of the Road System2025 IEEE International Conference on Intelligent Transportation Systems (ITSC) conference-paper Engineering Embedded Systems and FPGA Design Open access
Ventseslav Yordanov, Simon Schäfer, Alexander Mann, Stefan Kowalewski, Bassam Alrifaee, Lutz Eckstein
0citations -
Revisiting heat treatments for additive manufactured parts: A case study of A20X alloy2022 Materials & Design article Engineering Additive Manufacturing Materials and Processes Open access
Jayant Barode, Ashok Vayyala, Enrico Virgillito, Alberta Aversa, Joachim Mayer, Paolo Fino, +1 more
27citations -
Understanding the damage initiation and growth mechanisms of two DP800 dual phase grades2024 Materials & Design article Engineering Microstructure and Mechanical Properties of Steels Open access
Chunhua Tian, Carl F. Kusche, Subin Lee, Maximilian A. Wollenweber, Reinhard Pıppan, Sandra Korte‐Kerzel, +1 more
16citations -
Flexible, Self-Adaptive Sense-and-Compress SoC for Sub-microWatt Always-On Sensory Recording2020 IEEE Solid-State Circuits Letters article Engineering Analog and Mixed-Signal Circuit Design Open access
Jaro De Roose, Haoming Xin, Ahmed Hallawa, Gerd Ascheid, Pieter J. A. Harpe, Marian Verhelst
12citations -
Nanodiamond Influence on the Nucleation and Growth of YBCO Superconducting Film Deposited by Metal–Organic Decomposition2023 Crystal Growth & Design article Engineering Superconducting Materials and Applications Open access
Valentina Pinto, Angelo Vannozzi, G. Celentano, M. Tomellini, Alexander Meledin, Silvia Orlanducci
7citations -
Processing of Keyhole Depth Measurement Data during Laser Beam Micro Welding2020 Proceedings of the Institution of Mechanical Engineers Part L Journal of Materials Design and Applications article Engineering Welding Techniques and Residual Stresses cited by 1 patent
Sören Hollatz, Marc Hummel, Lea Jaklen, Wiktor Lipnicki, Alexander M. Olowinsky, Arnold Gillner
7citations -
Physical Modeling of InP/InGaAs DHBTs With Augmented Drift-Diffusion and Boltzmann Transport Equation Solvers—Part I: Simulation Tools and Application to Sample Structures2023 IEEE Transactions on Electron Devices article Engineering Advancements in Semiconductor Devices and Circuit Design
Hendrik Leenders, Markus A. Müller, Christoph Jungemann, M. Schröter
5citations -
Fabrication of Ultrasmall Si Encapsulated in Silicon Dioxide and Silicon Nitride as Alternative to Impurity Doping2023 physica status solidi (a) article Engineering Advancements in Semiconductor Devices and Circuit Design Open access
M. Frentzen, Michail Michailow, Ke Ran, Noël Wilck, Joachim Mayer, Sean Campbell Smith, +2 more
2citations -
Introducing Instruction-Accurate Simulators for Performance Estimation of Autotuning Workloads2025 ACM/IEEE Design Automation Conference (DAC) conference-paper Computer Science Parallel Computing and Optimization Techniques Open access
Rebecca Pelke, Nils Bosbach, Lennart M. Reimann, Rainer Leupers
0citations