July 16, 2026 article Machine learning-driven process optimization for ultra-low loop wedge bonding in monolithic microwave integrated circuit packaging Journal of Intelligent Manufacturing DOI: 10.1007/s10845-026-02928-x OpenAlex Authors 0 Author list not loaded yet. Cited by 0 stored of 0 References 1 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Development of a semi-automated data acquisition and processing architecture for machine learning applications in grinding 2026 Journal of Intelligent Manufacturing article Engineering Advanced machining processes and optimization Open access 1 citations 1 result