December 02, 2025 conference-paper Toward Lifetime Prediction Under Variable Load Conditions in Power Electronics: Evaluation of Damage Accumulation Rules for Solder System Attach IEEE Electronics Packaging Technology Conference (EPTC) DOI: 10.1109/eptc67330.2025.11392357 OpenAlex Authors 0 Author list not loaded yet. Cited by 0 stored of 0 References 1 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access A Streamlined Test-Oriented Lifetime Assessment Framework for Automotive Power Electronics Converters 2025 IEEE Transactions on Power Electronics article Engineering Silicon Carbide Semiconductor Technologies Open access 3 citations 1 result