February 11, 2026 article Open access Stress-driven reliability-by-design for heterogeneous integration: from packaging architectures to intelligent management Chip DOI: 10.1016/j.chip.2026.100195 Full text (OA) OpenAlex Authors 0 Author list not loaded yet. Cited by 0 stored of 2 References 1 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Characterization and modeling cure- and pressure-dependent thermo-mechanical and shrinkage behavior of fast curing epoxy resins 2022 Polymer Testing article Engineering Epoxy Resin Curing Processes Open access 49 citations 1 result