Multimodal In Situ Electron Microscopy Platform for Correlative Electro-Thermal Characterization and Failure Analysis
Proceedings - International Symposium for Testing and Failure Analysis, vol. 85212, pp. 567–568
Abstract
Abstract We introduce a correlative in situ platform for electro-thermal studies in both TEM and SEM using the same MEMS-based Nano-Chip. Equipped with up to eight electrodes, the chip enables precise electrical biasing and localized heating of as prepared samples under real operating conditions. A dedicated SEM holder ensures seamless, damage-free transfer from TEM, combining atomic-scale imaging with SEM analytics (EDX, EBSD, TKD) and optional AFM integration. Designed for semiconductor materials, the system captures real-time structural evolution during heating and biasing, delivering artifact-free, multimodal insights for semiconductor reliability, device optimization, and advanced materials development.
Authors 8
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Affiliation as printed
DENSsolutions B.V., Informaticalaan 12, 2628 ZD Delft , The Netherlands
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Affiliation as printed
DENSsolutions B.V., Informaticalaan 12, 2628 ZD Delft , The Netherlands
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Affiliation as printed
DENSsolutions B.V., Informaticalaan 12, 2628 ZD Delft , The Netherlands
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Affiliation as printed
DENSsolutions B.V., Informaticalaan 12, 2628 ZD Delft , The Netherlands
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Affiliation as printed
DENSsolutions B.V., Informaticalaan 12, 2628 ZD Delft , The Netherlands
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Affiliation as printed
Institute of Energy Technologies - Fundamental Electrochemistry (IET-1) , Forschungszentrum Jülich GmbH, Jülich, Germany
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Forschungszentrum Jülich · RWTH Aachen University
Affiliation as printed
Faculty of Mechanical Engineering, RWTH Aachen University , Aachen, Germany
Institute of Energy Technologies - Fundamental Electrochemistry (IET-1) , Forschungszentrum Jülich GmbH, Jülich, Germany
Institute of Physical Chemistry, RWTH Aachen University , Aachen, Germany
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Affiliation as printed
DENSsolutions B.V., Informaticalaan 12, 2628 ZD Delft , The Netherlands
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