A Versatile Top-Down Patterning Technique for Perovskite On-Chip Integration

ACS Nano, vol. 19, pp. 30428–30440

Abstract

Metal-halide perovskites (MHPs) have exciting optoelectronic properties and are under investigation for various applications, such as photovoltaics, light-emitting diodes, and lasers. An essential step toward exploiting the full potential of this class of materials is their large-scale, on-chip integration with high-resolution, top-down patterning. The development of such patterning methods for perovskite films is challenging because of their intrinsic ionic nature and adverse reactions with the solvents used in standard lithography processes. Here, we introduce a versatile and precise method comprising photolithography and reactive ion etching (RIE) processes that can be tuned to accommodate different perovskite compositions and morphologies. Our method utilizes conventional photoresists at reduced temperatures to create micron-sized features down to 1 μm, providing high reproducibility from chip to chip. The patterning technique is validated through atomic force microscopy (AFM), X-ray diffraction (XRD), optical spectroscopy, and scanning electron microscopy (SEM). It enables the scalable and high-throughput on-chip monolithic integration of MHPs.

Authors 11

1. Federico Fabrizi Aachen AMO GmbH Chair of Electronic Devices

   AMO (Germany) · RWTH Aachen University

   Affiliation as printed

   AMO GmbH, Otto-Blumenthal-Straße 25, Aachen 52074, Germany

   Chair of Electronic Devices, RWTH Aachen University, Otto-Blumenthal-Straße 25, Aachen 52074, Germany

2. Sana Khan Aachen AMO GmbH Chair of Electronic Devices

   AMO (Germany) · RWTH Aachen University

   Affiliation as printed

   AMO GmbH, Otto-Blumenthal-Straße 25, Aachen 52074, Germany

   Chair of Electronic Devices, RWTH Aachen University, Otto-Blumenthal-Straße 25, Aachen 52074, Germany

3. Tauheed Mohammad Aachen AMO GmbH

   AMO (Germany)

   Affiliation as printed

   AMO GmbH, Otto-Blumenthal-Straße 25, Aachen 52074, Germany

4. Liudmila Starodubtceva Aachen Chair of Electronic Devices

   RWTH Aachen University

   Affiliation as printed

   Chair of Electronic Devices, RWTH Aachen University, Otto-Blumenthal-Straße 25, Aachen 52074, Germany

5. Piotr Jacek Cegielski Aachen AMO GmbH

   AMO (Germany)

   Affiliation as printed

   AMO GmbH, Otto-Blumenthal-Straße 25, Aachen 52074, Germany

6. P. Haring Bolívar

   University of Siegen

   Affiliation as printed

   Institute for High Frequency and Quantum Electronics

   University of Siegen

7. Thomas Riedl

   University of Wuppertal

   Affiliation as printed

   Institute of Electronic Devices, University of Wuppertal, Rainer-Gruenter-Str. 21, Wuppertal 42119, Germany

   Wuppertal Center for Smart Materials & Systems (CM@S), University of Wuppertal, Rainer-Gruenter-Str. 21, Wuppertal 42119 Germany

8. Gerhard Müller‐Newen Aachen Institute of Biochemistry and Molecular Biology

   Universitätsklinikum Aachen · RWTH Aachen University

   Affiliation as printed

   Institute of Biochemistry and Molecular Biology, Uniklinik RWTH Aachen , Pauwelsstrasse 30, Aachen 52074 Germany

9. Surendra B. Anantharaman Aachen AMO GmbH

   Indian Institute of Technology Madras · AMO (Germany)

   Affiliation as printed

   AMO GmbH, Otto-Blumenthal-Straße 25, Aachen 52074, Germany

   Indian Institute of Technology Madras

   Low-dimensional Semiconductors Lab, Department of Metallurgical and Materials Engineering

10. Maryam Mohammadi corresponding Aachen AMO GmbH

    AMO (Germany)

    Affiliation as printed

    AMO GmbH, Otto-Blumenthal-Straße 25, Aachen 52074, Germany

11. Max C. Lemme corresponding Aachen AMO GmbH Chair of Electronic Devices

    AMO (Germany) · RWTH Aachen University

    Affiliation as printed

    AMO GmbH, Otto-Blumenthal-Straße 25, Aachen 52074, Germany

    Chair of Electronic Devices, RWTH Aachen University, Otto-Blumenthal-Straße 25, Aachen 52074, Germany