Graphene MEMS and NEMS
Microsystems & Nanoengineering, vol. 10, pp. 154
Abstract
Graphene is being increasingly used as an interesting transducer membrane in micro- and nanoelectromechanical systems (MEMS and NEMS, respectively) due to its atomical thickness, extremely high carrier mobility, high mechanical strength, and piezoresistive electromechanical transductions. NEMS devices based on graphene feature increased sensitivity, reduced size, and new functionalities. In this review, we discuss the merits of graphene as a functional material for MEMS and NEMS, the related properties of graphene, the transduction mechanisms of graphene MEMS and NEMS, typical transfer methods for integrating graphene with MEMS substrates, methods for fabricating suspended graphene, and graphene patterning and electrical contact. Consequently, we provide an overview of devices based on suspended and nonsuspended graphene structures. Finally, we discuss the potential and challenges of applications of graphene in MEMS and NEMS. Owing to its unique features, graphene is a promising material for emerging MEMS, NEMS, and sensor applications.
Authors 7
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Xuge Fan corresponding
Beijing Institute of Technology
Affiliation as printed
Advanced Research Institute of Multidisciplinary Sciences, Beijing Institute of Technology, 100081, Beijing, China. xgfan@bit.edu.cn
Center for Interdisciplinary Science of Optical Quantum and NEMS Integration, School of Physics, Beijing Institute of Technology, 100081, Beijing, China. xgfan@bit.edu.cn
School of Integrated Circuits and Electronics, Beijing Institute of Technology, 100081, Beijing, China. xgfan@bit.edu.cn
Advanced Research Institute of Multidisciplinary Sciences, Beijing Institute of Technology, 100081, Beijing, China
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Beijing Institute of Technology
Affiliation as printed
Advanced Research Institute of Multidisciplinary Sciences, Beijing Institute of Technology, 100081, Beijing, China
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Jie Ding corresponding
Beijing Institute of Technology
Affiliation as printed
School of Integrated Circuits and Electronics, Beijing Institute of Technology, 100081, Beijing, China. jie.ding@bit.edu.cn
School of Integrated Circuits and Electronics, Beijing Institute of Technology, 100081, Beijing, China
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Beijing Institute of Technology
Affiliation as printed
Advanced Research Institute of Multidisciplinary Sciences, Beijing Institute of Technology, 100081, Beijing, China
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Beijing Institute of Technology
Affiliation as printed
Advanced Research Institute of Multidisciplinary Sciences, Beijing Institute of Technology, 100081, Beijing, China
School of Integrated Circuits and Electronics, Beijing Institute of Technology, 100081, Beijing, China
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Max C. Lemme Aachen AMO GmbH Chair of Electronic Devices Faculty of Electrical Engineering and Information Technology
AMO (Germany) · RWTH Aachen University
Affiliation as printed
AMO GmbH, Otto-Blumenthal-Str. 25, 52074, Aachen, Germany
Chair of Electronic Devices, Faculty of Electrical Engineering and Information Technology, RWTH Aachen University, Otto-Blumenthal-Str. 25, 52074, Aachen, Germany
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Wendong Zhang corresponding
Affiliation as printed
National Key Laboratory for Electronic Measurement Technology, School of Instrument and Electronics, North University of China, Taiyuan, 030051, China. wdzhang@nuc.edu.cn
State Key Laboratory of Dynamic Measurement Technology, North University of China, Taiyuan, 030051, China. wdzhang@nuc.edu.cn
State Key Laboratory of Dynamic Measurement Technology, North University of China, Taiyuan, 030051, China
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