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August 08, 2023 conference-paper

A case study of intermetallic evolutions in a solder joint under electromigration using a novel experiment-simulation combined approach

International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept59018.2023.10492118 OpenAlex

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Machine-learning-based surrogate modeling of microstructure evolution using phase-field
2022 Computational Materials Science article Materials Science Machine Learning in Materials Science

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