Suspended Two-Dimensional Material Membranes For Sensor Applications Fabricated With A High-Yield Transfer Process

Proceedings, IEEE micro electro mechanical systems, pp. 627–630

Abstract

This paper reports a novel dry-transfer method for suspending and patterning two-dimensional (2D) materials across closed (sealed) cavities on a target substrate. The process utilizes handling frames and heat to ensure sufficient adhesion and a multi-layer resist stack to pattern the suspended thin films. The yield of intact suspended monolayer graphene membranes is up to more than 75 %, higher than formerly reported [1]–[3]. The process also demonstrates high yields of intact membranes of double-layer graphene and of two different transition metal dichalcogenides. The process flow can be applied to the fabrication of various sensor applications, such as pressure sensors.

Authors 11

1. Sebastian Lukas Aachen Chair of Electronic Devices

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University,Chair of Electronic Devices,Aachen,Germany,52074

2. Ines Kraiem Aachen Chair of Electronic Devices Advanced Microelectronic Center Aachen

   AMO (Germany) · RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University,Chair of Electronic Devices,Aachen,Germany,52074

   Advanced Microelectronic Center Aachen, AMO GmbH, Aachen, Germany

3. Maximilian Prechtl

   Universität der Bundeswehr München

   Affiliation as printed

   University of the Bundeswehr Munich,Institute of Physics, Faculty of Electrical Engineering and Information Technology (EIT 2) and Center for Integrated Sensor Systems,Neubiberg,Germany,85577

4. Oliver Hartwig

   Universität der Bundeswehr München

   Affiliation as printed

   University of the Bundeswehr Munich,Institute of Physics, Faculty of Electrical Engineering and Information Technology (EIT 2) and Center for Integrated Sensor Systems,Neubiberg,Germany,85577

5. Annika Grundmann Aachen

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University,Compound Semiconductor Technology,Aachen,Germany,52074

6. H. Kalisch Aachen

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University,Compound Semiconductor Technology,Aachen,Germany,52074

7. Satender Kataria Aachen Chair of Electronic Devices

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University,Chair of Electronic Devices,Aachen,Germany,52074

8. M. Heuken Aachen

   Aixtron (Germany) · RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University,Compound Semiconductor Technology,Aachen,Germany,52074

   AIXTRON SE, Herzogenrath, Germany

9. Andrei Vescan Aachen

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University,Compound Semiconductor Technology,Aachen,Germany,52074

10. Georg Stefan Duesberg

    Universität der Bundeswehr München

    Affiliation as printed

    University of the Bundeswehr Munich,Institute of Physics, Faculty of Electrical Engineering and Information Technology (EIT 2) and Center for Integrated Sensor Systems,Neubiberg,Germany,85577

11. Max C. Lemme Aachen Chair of Electronic Devices Advanced Microelectronic Center Aachen

    AMO (Germany) · RWTH Aachen University

    Affiliation as printed

    RWTH Aachen University,Chair of Electronic Devices,Aachen,Germany,52074

    Advanced Microelectronic Center Aachen, AMO GmbH, Aachen, Germany