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January 01, 2022 book-chapter Aachen paper

Interconnect Architectures for 3D Technologies

Springer eBooks, pp. 27–47

DOI: 10.1007/978-3-030-98229-4_2 OpenAlex

Authors 4

  1. Lennart Bamberg

    NXP (Germany)

    Affiliation as printed

    NXP Semiconductors, Hamburg, Germany

  2. Jan Moritz Joseph Aachen

    RWTH Aachen University

    Affiliation as printed

    RWTH Aachen University, Aachen, Germany

  3. Alberto García-Ortiz

    University of Bremen

    Affiliation as printed

    Universität Bremen, Bremen, Germany

  4. Thilo Pionteck

    Otto-von-Guericke-Universität Magdeburg

    Affiliation as printed

    Otto-von-Guericke Universität Magdeburg, Magdeburg, Germany

Cited by 2 stored of 2

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References 61