Radio Frequency Fingerprint Identification Based on Slice Integration Cooperation and Heat Constellation Trace Figure
IEEE Wireless Communications Letters, vol. 11, pp. 543–547
Abstract
Radio frequency fingerprint (RFF) identification is a popular topic in the field of physical layer security. However, machine learning based RFF identification methods require complicated feature extraction manually while deep learning based methods are hard to achieve robust identification performance. To solve these problems, we propose a novel RFF identification method based on heat constellation trace figure (HCTF) and slice integration cooperation (SIC). HCTF is utilized to avoid the manual feature extraction and SIC is adopted to extract more features automatically in RF signals. Experimental results show that our proposed HCTF-SIC identification method can achieve higher accuracy than the existing RFF methods. The identification accuracy achieves 91.07% when SNR$\pmb {=}$0 dB and it is even higher than 99.64% when the SNR$\pmb {\ge }$5 dB.
Authors 6
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Nanjing University of Posts and Telecommunications
Affiliation as printed
College of Telecommunications and Information Engineering, Nanjing University of Posts and Telecommunications, Nanjing, China
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Nanjing University of Posts and Telecommunications
Affiliation as printed
College of Telecommunications and Information Engineering, Nanjing University of Posts and Telecommunications, Nanjing, China
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Nanjing University of Posts and Telecommunications
Affiliation as printed
College of Telecommunications and Information Engineering, Nanjing University of Posts and Telecommunications, Nanjing, China
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Nanjing University of Posts and Telecommunications
Affiliation as printed
College of Telecommunications and Information Engineering, Nanjing University of Posts and Telecommunications, Nanjing, China
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Manchester Metropolitan University
Affiliation as printed
Department of Engineering, Faculty of Science and Engineering, Manchester Metropolitan University, Manchester, U.K
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Affiliation as printed
Institute for Communication Technologies and Embedded Systems, RWTH Aachen University, Aachen, Germany
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