December 01, 2021 article Temperature-related tensile modulus of polymer-based adhesive films The Journal of Adhesion DOI: 10.1080/00218464.2021.2011239 OpenAlex Authors 0 Author list not loaded yet. Cited by 1 stored of 8 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Investigation of the thermal strain behaviour of bonded joints in a cryogenic environment 2023 The Journal of Adhesion article Engineering Electronic Packaging and Soldering Technologies 2 citations 1 result References 0