Self-Assembling Flexible 3D-MEAs for Cortical Implants
Current Directions in Biomedical Engineering, vol. 7, pp. 359–362
Abstract
Abstract Flexible Multi Electrode Arrays (MEAs) for neural interfacing reduce the mechanical mismatch between the soft brain tissue and the electrode arrays allowing accurate signal recordings and neural stimulation while reducing inflammatory responses. Many standard manufacturing processes of MEAs are designed for planar structures and the production of three-dimensional structures is challenging. In the present study, shaft structures with one to two circular gold microelectrodes (10 - 20 μm), each on a base polyimide (PI) substrate, were investigated. We describe a fabrication method, with which shafts made from bi-layer PI flip into the third dimension, which is a first step towards spontaneous assembly of electrodes in flexible 3D MEAs for neuroelectronic applications. A lift-up of the shafts was achieved by the contraction of a second PI layer and a steady nitrogen flow during polycondensation. This shrinking PI was structured in pits with a width of 5 - 600 μm. We achieved liftup angles of up to 42 degrees. The shaft structures can be hardened and later be used for neural implantation experiments.
Authors 4
-
Affiliation as printed
Institute of Materials in Electrical Engineering 1 (IWE1), RWTH Aachen University, Aachen , Germany
-
Andrea Kauth Aachen
Affiliation as printed
RWTH Aachen University, Aachen , Germany
-
Fraunhofer Institute for Microelectronic Circuits and Systems · University of Duisburg-Essen
Affiliation as printed
Fraunhofer Institute for Microelectronic Circuits and Systems, Duisburg, Germany and Department of Electronic Components and Circuits and Center for Nanointegration Duisburg- Essen (CENIDE), University of Duisburg-Essen, Duisburg , Germany
-
Sven Ingebrandt Aachen
Affiliation as printed
RWTH Aachen University, Aachen , Germany
Cited by 1 stored of 1
1 result
No patents citing this paper on Lens.org (checked 2026-10-06).
References 9
9 results