April 13, 2021 article Open access Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging Energies DOI: 10.3390/en14082176 Full text (OA) OpenAlex Authors 0 Author list not loaded yet. Cited by 0 stored of 15 References 1 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Exploiting Distinct Thermal Response Properties for Power Semiconductor Module Health Monitoring 2020 IEEE Journal of Emerging and Selected Topics in Power Electronics article Engineering Silicon Carbide Semiconductor Technologies cited by 4 patents 20 citations 1 result