November 03, 2016 article Integrated Through-Silicon Via Placement and Application Mapping for 3D Mesh-Based NoC Design ACM Transactions on Embedded Computing Systems DOI: 10.1145/2968446 OpenAlex Authors 0 Author list not loaded yet. Cited by 1 stored of 19 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Network Synthesis and SoC Floor Planning 2022 Springer eBooks book-chapter Computer Science Interconnection Networks and Systems 1 citations 1 result References 0