June 01, 2007 conference-paper Challenges for 3D IC integration: bonding quality and thermal management DOI: 10.1109/iitc.2007.382392 OpenAlex Authors 0 Author list not loaded yet. Cited by 1 stored of 96 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Bridging the Frequency Gap in Heterogeneous 3D SoCs through Technology-Specific NoC Router Architectures 2021 Asia and South Pacific Design Automation Conference (ASP-DAC) conference-paper Computer Science Interconnection Networks and Systems 2 citations 1 result References 0