September 01, 2013 conference-paper How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core IEEE Custom Integrated Circuits Conference (CICC) DOI: 10.1109/cicc.2013.6658541 OpenAlex Authors 0 Author list not loaded yet. Cited by 1 stored of 20 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Scaling Logic Area With Multitier Standard Cells 2024 IEEE Journal on Exploratory Solid-State Computational Devices and Circuits article Engineering 3D IC and TSV technologies Open access 0 citations 1 result References 0