September 01, 2003 article Void-induced thermal impedance in power semiconductor modules: Some transient temperature effects IEEE Transactions on Industry Applications DOI: 10.1109/tia.2003.816527 OpenAlex Authors 0 Author list not loaded yet. Cited by 2 stored of 156 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Designing Power Module Health Monitoring Systems Based on Converter Load Profile 2020 IEEE Transactions on Industry Applications article Engineering Advanced DC-DC Converters 15 citations Exploiting Distinct Thermal Response Properties for Power Semiconductor Module Health Monitoring 2020 IEEE Journal of Emerging and Selected Topics in Power Electronics article Engineering Silicon Carbide Semiconductor Technologies cited by 4 patents 20 citations 2 results References 0