April 01, 2013 article Open access Comparison of Junction Temperature Evaluations in a Power IGBT Module Using an IR Camera and Three Thermosensitive Electrical Parameters IEEE Transactions on Industry Applications DOI: 10.1109/tia.2013.2255852 Full text (OA) OpenAlex Authors 0 Author list not loaded yet. Cited by 3 stored of 231 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Reviewing Thermal-Monitoring Techniques for Smart Power Modules 2021 IEEE Journal of Emerging and Selected Topics in Power Electronics article Engineering Silicon Carbide Semiconductor Technologies cited by 1 patent 78 citations Real-Time Monitoring of Thermal Response and Life-Time Varying Parameters in Power Modules 2020 IEEE Transactions on Industry Applications article Engineering Silicon Carbide Semiconductor Technologies 49 citations Effects of Self-Heating on ${f}_{\text{T}}$ and ${f}_{\text{max}}$ Performance of Graphene Field-Effect Transistors 2020 IEEE Transactions on Electron Devices article Materials Science Graphene research and applications Open access 12 citations 3 results References 0