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Papers matching “adhesive bonding” in Epoxy Resin Curing Processes 3

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Investigation of the applicability of the time-temperature superposition principle within the cryogenic temperature range, illustrated by a two-component epoxy adhesive
2025 The Journal of Adhesion article Engineering Epoxy Resin Curing Processes Open access

Robert Seewald, Alexander Schiebahn, Uwe Reisgen

0

citations
Curing of epoxy adhesives between thin metal foils by means of inductive heating
2024 Proceedings of the Institution of Mechanical Engineers Part L Journal of Materials Design and Applications article Engineering Epoxy Resin Curing Processes

Vinzenz Ginster, Maximilian K. Heym, Christoph Jürgen Anton Beier, Maike Epperlein, Alexander Schiebahn, Uwe Reisgen

3

citations
Inductive Curing of 2C Epoxy Adhesives in Foil to Foil Specimens
2024 Proceedings in engineering mechanics conference-paper Engineering Epoxy Resin Curing Processes

Vinzenz Ginster, Christoph Jürgen Anton Beier, Alexander Schiebahn, Uwe Reisgen

1

citations

3 results