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Current Compliance-Driven Morphological Evolution of Conductive Filaments in ECM Cells: Mechanisms, Switching Regimes, and Thermal Effects2026 Advanced Materials Technologies article Engineering Advanced Memory and Neural Computing Open access
Milan Buttberg, Christina Schindler, Ilia Valov, Stephan Menzel
0citations -
Mixed Hot-Carrier/Bias Temperature Instability Degradation Regimes in Full { V G , V D } Bias Space: Implications and Peculiarities2020 IEEE Transactions on Electron Devices article Engineering Semiconductor materials and devices Open access
Markus Jech, G. Rott, H. Reisinger, Stanislav E. Tyaginov, G. Rzepa, Alexander Grill, +4 more
36citations -
Fully Recyclable Printed Magnetoresistive Sensors Covering Broad Operational Ranges for Sustainable Interactive Electronics2026 Advanced Electronic Materials article Engineering Magnetic Field Sensors Techniques Open access
Rui Xu, Guannan Mu, Shirong Huang, Sebastian Lehmann, Gianaurelio Cuniberti, Kornelius Nielsch, +1 more
1citations
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